B04-Materials and devices for heterogeneous integration
Symposium Introduction
As the demand for advanced electronic systems continues to grow, the integration of diverse materials and devices has become a critical area of research and development. This symposium aims to bring together experts from academia, industry, and government to discuss the latest advancements and challenges in heterogeneous integration. By exploring innovative materials, novel device architectures, and cutting-edge fabrication techniques, we seek to pave the way for the next generation of high-performance, multifunctional systems.
Symposium Topics
1, Advanced Materials for Heterogeneous Integration
2，Innovative Device Architectures
3，Fabrication and Processing Techniques
4，Applications and System-Level Integration
Symposium Organizers
|
|
Name |
Institution |
|
| Chair |
Ye Zhou |
Shenzhen University |
yezhou@szu.edu.cn |
| Co-chairs |
Vellaisamy Arul Lenus Roy |
Hong Kong Metropolitan University |
vroy@hkmu.edu.hk |
|
Su-Ting Han |
The Hong Kong Polytechnic University |
suting.han@polyu.edu.hk |
|
|
Meng Zhang |
Shenzhen University |
zhangmeng@szu.edu.cn |
|
| Qijun Sun |
Guangdong University of Technology |
qjsun@gdut.edu.cn |
|
|
Xiaoguang Liang |
Guangxi Normal University |
lxg8521@gxnu.edu.cn |
Organized by
Shenzhen University
Supported by
State Key Laboratory of Radio Frequency Heterogeneous Integration, Hong Kong Metropolitan University, The Hong Kong Polytechnic University, Guangdong University of Technology
Contact with
Name: Jingya Yang
Phone: +86-15014864206
Email: yangjingya@szu.edu.cn
Institution: Shenzhen University
