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D13-Advanced Thermal Management Materials


Symposium Introduction

With the continuous miniaturization of electronic devices and the increase in integration density, efficient thermal management has become a critical bottleneck restricting the development of devices with high power density. This symposium will focus on the recent and state-of-the-art research progress on thermal management materials.

Symposium Topics

1. Nanoscale Thermoelectric Materials
2. Thermal Protection Materials
3. Thermal Interface Materials
4. Advanced Theory for Thermal Control
5. Advanced Electronic Packaging Materials
6. Highly thermally conductive Materials
7. Flexible Thermal Management Materials 
…..

Symposium Organizers 

Name

Institution

E-mail
Chairs

Gang Zhang

Beijing Institute of Technology

Gangzhang2006@gmail.com

Jun-Wei Gu

Northwestern Polytechnical University

gjw@nwpu.edu.cn

Kedar Hippalgaonkar

Nanyang Technology University, Singapore

Co-chairs  

Ady Suwardi

The Chinese University of Hong Kong

asuwardi@ee.cuhk.edu.hk

Keqiu Chen

Hunan Technology

keqiuchen@hnu.edu.cn

Yuan Cheng

Monash University, Australia

yuan.cheng@monash.edu

Yingyan Zhang

RMIT, Australia

yingyan.zhang@rmit.edu.au

Organized by

CMRS

Contact with

Name: Meng An

E-mail: yingyan.zhang@rmit.edu.au

Institution: University of Tokyo

Name: Jian Zhang

Phone:+86-15624430679

E-mail: zhangjian@bit.edu.cn

Institution: Beijing Institute of Technology


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