D13-Advanced Thermal Management Materials
Symposium Introduction
With the continuous miniaturization of electronic devices and the increase in integration density, efficient thermal management has become a critical bottleneck restricting the development of devices with high power density. This symposium will focus on the recent and state-of-the-art research progress on thermal management materials.
Symposium Topics
1. Nanoscale Thermoelectric Materials
2. Thermal Protection Materials
3. Thermal Interface Materials
4. Advanced Theory for Thermal Control
5. Advanced Electronic Packaging Materials
6. Highly thermally conductive Materials
7. Flexible Thermal Management Materials
…..
Symposium Organizers
|
|
Name | Institution |
| Chairs |
Gang Zhang |
Beijing Institute of Technology |
|
Jun-Wei Gu |
Northwestern Polytechnical University |
|
|
Ady Suwardi |
The Chinese University of Hong Kong |
|
| Co-chairs |
Yingyan Zhang |
RMIT, Australia |
|
Keqiu Chen |
Hunan Technology |
|
|
Yuan Cheng |
Monash University, Australia |
|
|
Meng An |
University of Tokyo |
Organized by
CMRS
Contact with
Name: Jian Zhang
Phone:+86-15624430679
E-mail: zhangjian@bit.edu.cn
Institution: Beijing Institute of Technology
