Program At A Glance
| Thursday, October 30, 2025 | |
| Time | Event |
| 08:00-08:20 | Opening Remarks |
| 08:20-08:50 | Keynote Speech |
| 08:50-10:15 | Session 1: FEOL CMP |
| 10:15-10:45 | Coffee Break & Exhibition |
| 10:45-12:10 | Session 2: BEOL CMP |
| 12:10-13:00 | Lunch Break & Exhibition |
| 13:00-14:45 | Session 3: Post CMP Cleaning |
| 14:45-15:15 | Coffee Break & Exhibition |
| 15:15-17:25 | Session 4: 3D ICs/TSV/Packaging Applications |
| 17:25-18:30 | Poster Session 1 |
| 18:30-19:30 | Welcome Reception |
| Friday, October 31, 2025 | |
| Time | Event |
| 08:00-08:30 | Keynote Speech |
| 08:30-09:55 | Session 5: Equipment, Process Control and Metrology |
| 09:55-10:00 | Next Year ICPT Introduction |
| 10:00-10:25 | Coffee Break & Exhibition |
| 10:25-11:50 | Session 6: CMP Consumables |
| 11:50-12:10 | Award Ceremony |
| 12:10-13:00 | Lunch Break & Exhibition |
| 13:00-14:45 | Session 7: Substrate Polishing such as Si, SiC, GaN and Diamond |
| 14:45-15:15 | Coffee Break & Exhibition |
| 15:15-17:20 | Session 8: CMP Fundamentals, Modeling and Simulation |
| 17:20-18:30 | Poster Session 2 |
| 18:30-21:00 | Banquet |
| Saturday, November 1, 2025 | |
| Time | Event |
| 08:00-08:30 | Keynote Speech |
| 08:30-09:55 | Session 9: BEOL CMP & Defects, reliability issues and Post CMP cleaning |
| 09:55-10:25 | Coffee Break & Exhibition |
| 10:25-11:50 | Session 10: 3D ICs/TSV/Packaging Applications |
| 11:50-12:00 | Student Paper Award |
| 12:00-12:10 | Closing Remarks |
| 12:10-13:30 | Lunch Break & Exhibition |
| 14:00-17:00 | Social Event |
